Job Details:
Job Description:
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor
Salary:$85.2k - $162.5k
- ID: #55250067
- State: Arizona Phoenix 85001 Phoenix USA
- City: Phoenix
- Salary: $85.2k - $162.5k
- Job type: Full-time
- Showed: 2026-08-01
- Deadline: 2026-09-29
- Category: Internet engineering