Advanced IC Package Designer

The application window is expected to close on: 12/09/2024.Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.Meet the TeamCisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. Your Impact Cisco SiliconOne ASIC team is looking for an advanced IC package designer to help us develop our next generation silicon and platforms. You will work on cutting-edge FCBGA substrates that push the boundaries on power, speed, and fabrication / assembly technology. You will drive package planning & layout to enable on-time, high-quality manufacturing releases. You will be a proficient learner, you will actively implement new technologies and rules, and you will excel in documenting and communicating critical information to the team.

Collaborate with ASIC and Physical Design teams to evaluate and develop floorplans that result in optimal substrate integration

Work with multi-disciplinary teams (system, thermal, mechanical, connector) to understand needs and to create guidance for package implementation

Plan substrate designs, including stackups, materials, and design rules, optimized to meet stringent Signal Integrity and Power Integrity rules

Implement package routing with fabrication/assembly aware approach

Design and build power connectivity structures for high power applications

Drive designs towards successful, on-time completion while meeting important milestones

Contribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammates

Negotiate with external manufacturing partners to specify and build best-in-class packages that meet stringent performance and test criteria

Minimum Qualifications:

Degree in Electrical Engineering or related field, or equivalent experience

4+ years in the industry with IC Package or PCB development

Fluent in Cadence Allegro Package Designer

Strong communication and documentation skills

Preferred Qualifications:

Fluent in Orbit IO

Fluent in Calibre for DRC verification

Experience with 2.5D package design, including wafer level fan-out

Experience with very large pin count packages or equivalent PCBs

Familiarity with AutoCAD

Working knowledge of Signal and Power Integrity fundamentals

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