Senior PCB Design Engineer

Who You’ll Work WithWorking closely with cross-functional teams including Hardware Design, Signal Integrity (SI), Power Integrity (PI), Mechanical Engineering, Thermal Engineering, and Manufacturing, our engineers innovate on system architectures and ultra-high-speed PCB designs to deliver state-of- the-art networking platforms.What You'll DoOur Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in enterprise campuses, hyperscale datacenters, and next-generation AI clusters. The team is responsible for end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments — including optical interface platforms up to 800G and 1.6T.Core Responsibilities High-Speed Layout & RoutingImplement complex routing for advanced interfaces such as 112G/224G SerDes, PCIe Gen 5/6, DDR4/5/6Design and route high-speed differential pairs with tight skew and impedance controlExecute dense BGA fan-out for high-pin-count ASICs and FPGAsOptical Transceiver PCB Layout (800G / 1.6T)Design and layout boards supporting high-bandwidth optical transceivers (QSFP-DD, OSFP, OSFP-XD or equivalent)Route 112G / 224G PAM4 electrical channels between switch ASICs and optical modulesDefine insertion loss budgets and coordinate with SI engineers to meet IEEE compliance requirementsOptimize breakout routing beneath high-density optical cagesImplement via stub mitigation strategies including backdrilling for ultra-high-speed signal pathsManage ground reference continuity, EMI control, and return path integrity near optical connectorsConsider thermal dissipation (20W–30W+ modules) in layout planningImpedance Control & Signal IntegrityDesign advanced multi-layer stack-ups (20–30+ layers)Calculate impedance profiles and ensure low-reflection, low-crosstalk performanceCollaborate with SI teams on channel modeling and pre-/post-layout simulationsPower Integrity (PI) OptimizationDesign robust Power Distribution Networks (PDNs) for high-current ASICsLayout multi-phase DC/DC converters for high transient loadsStrategically place decoupling capacitors to ensure wideband impedance stabilityThermal & Mechanical CoordinationIntegrate thermal vias, heat sink attachments, and high-conductivity materialsCoordinate mechanical constraints such as enclosure, airflow, and structural limitationsEnsure proper placement and structural integration of optical cagesAdvanced Fabrication DeliverablesGenerate comprehensive manufacturing packages (Gerber, ODB, IPC-2581)Define backdrilling parameters and impedance specificationsEnsure compliance with DFM, DFA, and DFT requirementsSupport boards through fabrication, assembly, and production rampLibrary & Feasibility OwnershipCreate and maintain high-density component footprints (e.g., large BGAs, optical module connectors)Participate in new product feasibility studiesDevelop detailed routing guidelines and work packages for layout partnersReview external placement and routing work to ensure quality and schedule adherence