Packaging Research and Development Integration Engineer

15 Sep 2025

Vacancy expired!

Job DescriptionAssembly Test & Technology Development (ATTD) Foveros Platform is looking for Process Integration Engineer to support Die Prep and Wafer Level Assembly Process Development in order to continue providing market disrupting products. We need motivated and experienced engineers to contribute and excel in Assembly Technology Development.Responsibilities will include but not limited to:

Manage New Product Introduction and Systems setup/Coordination, associated Process Development and quality through Die Prep and Wafer Level Assembly.

Own quality of product material in the factory and engage in understanding root cause, MBPS table and solution paths.

Lead Task Forces and working groups to promptly solve integrated problems.

Own and manage complex projects and drive schedules.

Lead design rule definitions and technology offerings from Die Prep and Wafer Level Assembly.

Candidate should exhibit the following behavioral traits and/or skills:

Good technical knowledge of Assembly and/or Fab processes and flows.

Have strong communication and presentation skills to work with various stakeholders and customers.

Demonstrate leadership skills and One Intel culture with teams spread across different geographies and organizations in and outside Intel.

QualificationsFor information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information (https://www.intel.com/content/www/us/en/jobs/hiring.html) .You must possess the below requirements to be initially considered for this position.Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.Minimum qualifications:

Candidate must possess a Masters degree with 2+ years of experience or Ph.D. with 1 year of experience Chemical/Materials/Mechanical/Electrical Engineering or Materials Science or Physics.

Preferred qualifications:

6 months of experience in the following:

Project/Program Management

Knowledge of NPI methodology DOE and statistical Process control.

Model based problem solving experience.

Familiarity with Assembly Process

working experience with External Customers Rudimentary knowledge of characterization techniques such as CSAM, Xray, XPS, FTIR, SEM, EDX, TOF-SIM.

Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Covid StatementIntel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.htmlWorking ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

Full-time
  • ID: #50275596
  • State: Georgia Atlanta 30301 Atlanta USA
  • City: Atlanta
  • Salary: USD TBD TBD
  • Showed: 2023-09-15
  • Deadline: 2023-11-13
  • Category: Et cetera