Wafer Bond Process Development Engineer

08 Aug 2026
Apply

into intelligence, inspiring the world to learn, communicate and advance faster than ever.Micron is looking for experienced process engineers with experience in the fields of wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). As a

Full-time
  • ID: #55274463
  • State: Idaho Boise 83701 Boise USA
  • City: Boise
  • Salary: USD TBD TBD
  • Showed: 2026-08-08
  • Deadline: 2026-10-03
  • Category: Internet engineering
Apply