Principal Advanced Packaging Design Engineer

22 Aug 2026
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and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal
Salary:$168.4k - $249.31k

Full-time
  • ID: #55306026
  • State: Vermont Vermont 05401 Vermont USA
  • City: Vermont
  • Salary: $168.4k - $249.31k
  • Showed: 2026-08-22
  • Deadline: 2026-10-18
  • Category: Systems/networking
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