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- Associates degree or equivalent in electronics technology
- Minimum of 7 years’ experience with complex analog, power, high speed digital, or RF PWB designs
- Demonstrated teamwork, coordination, and communication skills both locally and globally
- Demonstrated IPC PWB design principles knowledge
- Demonstrated ability to lead and supervise a team of eCAD designers or external vendors.
- Demonstrated experience with circuit stack-ups and routing with 2 to 14+ layers
- Experience with Cadence CAD capture and design tools
- Demonstrated experience with micro-vias, very fine pitch devices, and high-density processors/FPGAs (>1000 contact BGAs)
- Demonstrated experience with signal integrity constraints management
- Experience with Valor design checks
- Packaging circuit boards into mechanical enclosures and assemblies leveraging Cadence Design tools and IPC standards.
- Guide engineers in component selection, placement, stack-up and material cost, routing, in-circuit test point location, artwork generation, assembly drawing creation, manufacturing documentation, archival and configuration control
- Work with global suppliers and create design outputs with a global team
- Review external supplier layout designs to ensure high quality, as needed
- Institutionalize operating mechanisms that ensure standardization of work across multiple teams
- Utilizing independent judgement, construct, evaluate and improve complex engineering problem statements and promote creative solutions to improve engineering efficiency and outcomes.
- Take ownership for business objectives including delivery, EHS, productivity, cost management, serviceability, quality.
- Little to no direction is given in execution of job-related activities.
- Comply with EHS regulations and policies